SEA6000VX  Analysis Examples |
See-through Mapping Example 2: IC Package |
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This is an example of a non-destructive mapping measurement of an IC package using the SEA6000VX HS Finder, allowing you to grasp the distribution status of internal metal elements and the presence of high concentrations of lead.
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[Mapping is done from the top of the package]
 <Measurement conditions>
| Voltage: |
50kV |
| Current: |
1000µA |
| Beam size: |
0.5mm beam |
| 1 point size: |
0.1mm |
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5ms |
| No. of frames: |
3 times |
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<Image>
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Sample Image |
Ag (silver) map
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Au(gold) map |
Pb (lead) map |
Sn (tin) map |
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[Sample image and Element map superimposed]
Element maps are superimposed on the sample image.
Displays overlapping Sn (red), Ag (blue, and Au (green). Non-destructive analysis to element specification and shape of internal structure. By using the designated area integrated spectrum display function, detailed analysis from spectrum is performed even of information difficult to determine from the image only.
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