1. Dual Detector Employs both a semiconductor detector (no LN2 required ) that has superior X-ray energy resolution and a proportional counter that has a superior coefficient rate. The semiconductor detector is especially able to distinguish between elements that have contiguous energies such as Ni and Cu, and has the following merits. • Ni/Cu and Au/Ni/Cu measured without a secondary filter. • In the case of a print board that contain Br, capable of high precision Au coating thickness measurements without interference from Br. • Capable of measuring ultra-thin Au films less than 0.01μm. 2. Thin film FP Software Thin Film FP Software can be used for a wide range of applications including alloy plating with lead-free solder and composite plating. 3. Measurement of Microscoopic Area Round 15µm collimator standard installed, effective for measuring coating thickness in microscopic areas. 4. High Power X-ray Tube Equipped with 75W high-powered x-ray tube.

5. Observation of Microscopic Areas Can easily observe microscopic areas, equipped with four-step zoom. 6. Large Stage (SFT9455) Large stage enables measurement of large printed circuit boards. 7. Incident lighting makes samples easier to view. 8. Collision prevention sensor makes contoured samples safe to use. 9. High-accuracy stage drive train powered by servomotor. 10. Accurate Focus Measurement sample can be focused accurately by laser with one touch of the button. 11. Reporting Software Report can be easily generated from measurement data with macro software.