| Overview |
This fluorescent X-ray analysis device covers processes from RoHS/ELV screening to an advanced analysis. Our unique Vortex detector, a liquid nitrogen-free semiconductor detector with high count rate, and a newly designed developmental system increase sensitivity by over ten times compared to previous models. These improvements have reduced measurement time for areas as small as 0.5 to 1.2 mm. Improved sensitivity for micro spot measurements and a high-speed programable stage result in faster two-dimensional element mapping. |
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| Features |
1.High-Speed Mapping Analysis
The combination of significantly improved sensitivity of micro-spot fluorescent X-ray analysis and continuous high-speed motorized stage activation enables high-speed, elemental mapping images. Special filters for lead mapping in particular have been added to strengthen compliance with lead mapping in the board. It is also possible to detect even less than 1,000 ppm located in the lead-free solder.
2.High Resolution, Wide Area Optical System
A high resolution optical image of 20 micrometers or less can be acquired over an area of 250mm x 200mm. The location of measurement can be specified directly from this optical image with a high level of accuracy, resulting in dramatically improved operability. Additionally, overlapping the optical image with the mapping image obtained by high-speed mapping enables highly accurate analysis over a wide area.
3.High-speed Measurement of Trace Metal in Micro Spot
High sensitivity is possible through the high-density micro X-ray beam, on-board detector with a high count rate, and design that employs the detection efficiency of a fluorescent X-ray. The trace metals in the micro-spots and thin film can be measured in a short time. Hazardous substances in a 0.5mm square area can be measured in approximately 100 seconds.
4.High Count Rate Detector not Requiring Liquid Nitrogen
Comes standard equipped with SII NanoTechnology's unique High Count Rate Detector Vortex, for which the hassle of liquid nitrogen supply is unnecessary. Additionally, start-up time is as short as several minutes, and, as it is a thermoelectric cooling type, it is highly reliable. The device is very environmentally friendly thanks to reduced power consumption owing to increased measurement speed efficiency, reduced carbon dioxide generation during manufacturing and transportation of liquid nitrogen, and other factors.
5.Sequential Measurement
Up to 500 points on the samples on the stage can be registered from the wide optical view and each sample with different measurement conditions can be analyzed automatically.
6.Measurement of Film Thickness in Micro-spots
It is possible to measure the thickness of a thin film composite plating of Au/Ni/Cu (gold/nickel/copper) with an area of 0.2mm square with high accuracy in approximately 10 seconds. In addition, trace amounts lead contained in lead-free solder plating and electroless nickel plating can also be analyzed. |
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