XVision300, Hybrid FIB-SEM System

Name Hybrid FIB-SEM System
Type XVision300
Overview Based on the high performance automation platform of SIINT´s SMI3000SE/TB Double Beam/Triple Beam platform, this new product is equipped with the Gemini electron optics of Carl Zeiss NTS to offer 3 nm SEM resolution and 4 nm SEM resolution. Inheriting all the user-centric functionality of the SMI3000 series, XVision 300 is an essential tool for process monitoring in cleanrooms as well as for wafer-level failure analysis in the wafer fab laborato-ries.
Features 1. Real-time TEM lamella preparation monitoring during FIB milling with high resolution SEM
2. High quality TEM lamella preparation
3. High beam current ion beam for high throughput cross sectioning and TEM lamella preparation
4.Wide range of automated measurement functions
XVision 300 Hybrid FIB-SEM System
Specifications
 XVision300 XVision 300 DB/H XVision 300 DB/F Xvision 300 TB/H Xvision 300 TB/F
Sample size Maximum 300mm silicon wafer (JEIDA standard wafer)
Sample stage 5-axis motorized eucentric tilting stage
Forcused Ion Beam
Acceleration Voltage 1~30kV(5kV step)
Secondary Electron Observation Resolution 4nm
Maximum Current Density 45nA
Scanning Electron Microscope
Acceleration Voltage 1~30kV
Secondary Electron Observation Resolution 3nm
Argon Ion Beam
Acceleration Voltage
-
-
 0.5~1kV 0.5~1kV
Maximum Beam Current
-
-
 10nA 10nA
Sample handling options
  FOUP loader Holder loader FOUP loader Holder loader
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