| XVision300 |
XVision 300 DB/H |
XVision 300 DB/F |
Xvision 300 TB/H |
Xvision 300 TB/F |
| Sample size |
Maximum 300mm silicon wafer (JEIDA standard wafer) |
| Sample stage |
5-axis motorized eucentric tilting stage |
| Focused Ion Beam (FIB) |
| Acceleration Voltage |
1~30kV(5kV step) |
| Secondary Electron Observation Resolution |
4nm@30kV |
| Maximum Current Density |
30A/c2 |
| Scanning Electron Microscope (SEM) |
| Acceleration Voltage |
1~30kV |
| Maximum Beam Current |
3nm@5kV |
| Argon Ion Beam |
| Acceleration Voltage |
- |
- |
0.5~1kV |
0.5~1kV |
| Maximum Beam Current |
- |
- |
10nA（@1kV） |
10nA（@1kV） |
| Sample Handling Options |
| |
FOUP loader |
Holder loader |
FOUP loader |
Holder loader |
| Standard Options |
• Micro Probing System
• 4ch Multi-Gas Supply System |
|
