1. High Quality TEM Lamella Preparation Combination of low acceleration voltage FIB and Ar ion beam enables high quality TEM lamella prepatation. 2. Real-time Monitoring Real-time image monitoring at high magnification during Ga ion beam processing is possible with SEM. 3. High Throughput High throughput cross-sectioning and TEM lamella preparation with high current FIB is possible.

4. Continuous TEM Lamella Auto-finishing Software "Continuous A-TEM" a continuous TEM lammela finishing software is installed, enabling automatic creation of TEM lamella. 5. Lineup 4 systems in lineup: by its column type (Double Beam or Triple Beam) and transfer system. (Holder or FOUP)