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:: New Release :: |
| March 15, 2010 |
SII NanoTechnology Newly Releases XRF Coating Thickness Gauge SFT-110
Auto-positioning Function for Quick and Easy Coating Thickness Measurements
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Measurement and analysis instrument manufacturer SII NanoTechnology Inc. （SIINT） a 100% subsidiary of Seiko Instruments Inc. （SII）, will release the XRF Coating Thickness Gauge SFT-110 with enhanced operation by auto-positioning in early May.
For semiconductor materials, electronic components, automotive and other fields requiring plating and deposition, thickness and composition control are essential for maintaining quality and functionality as well as for reducing cost of the end product. SIINT originally created the first Japanese high-speed, non-contact precision measurement XRF Coating thickness meter in 1971, and since then has installed a total of 6,000 units developing it’s strong user base for foreign and domestic markets.
The newest addition to the SIINT product line addresses the need for higher through-put with the XRF Coating Thickness Gauge SFT-110 with all new Auto-positioning Function. This Auto-positioning Function enables focus of the sample observation to be done within a few seconds, simply by placing a sample on the stage. Subsequently, drastically higher through-put can be realized as the operation will not require manual adjustment of focus for each sample.
In addition, needs in recent years have trended towards smaller and smaller components. SFT-110 has enhanced small beam measurement capability with high-sensitivity X-ray, improving measurement precision with small-spot collimators (0.1, 0.2mm). In combination with the Thin Film FP software, measurement of a maximum 5 layers or 10 element multi-layer or alloy plating can be measured without standard substances, encompassing a wide range of applications. SII NanoTechnology Inc. through diverse product development continues to support quality management as well as compliance to environmental restrictions through X-ray technology.
[Main Features of SFT-110]
1. Auto-positioning Function for Increased Through-put
Focus adjustment which previously needed 10 seconds, can now be done in less than 3 seconds, drastically improving productivity.
2. Improved Plating Thickness Measurement for Small-spot
Minimized distance of X-ray optics and sample as well as other improvements, have allowed for increased precision of plating thickness measurement of small spot (0.1, 0.2mm)
3. Maximum 5 layer Measurement
Thin Film FP software allows for a maximum 5 layer or 10 element measurement, without the need for standard substances.
4. Wide Area Observation System (Option)
Measurement point can be set from a maximum 250 x 200mm sized sample, viewed at one time.
5. Large Size PCB Configuration (Option)
Large size PCB of 600 x 600mm can be measured.
6. Low Cost
20% Price reduction can be achieved, compared to previous models while improving performance.
[Specifications]
| Detector: |
Proportional Counter |
| X-ray Source: |
Air-cooled small type X-ray Tube |
| Collimator: |
0.1, 0.2mm round |
| Sample Observation: |
CCD Camera |
| Stage Motion: |
250(X) x 200(y)mm |
| Max. Sample Height: |
150mm |
[Sales Target]
300 units/year
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SFT-110 |
Contact Information
[Press Contact]
Public Relations Dept.
Seiko Instruments Inc.
Tel: +81-43-211-1185
[Product Inquiries]
T. Ikemoto
International Sales & Marketing
Analytical Sales Division
SII NanoTechnology Inc.
Tel: +81-3-6280-0066
Online Inquiry
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