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:: News Release :: |
| November 9, 2005 |
Releases the "SMI3000TB Series," the World's First Triple Beam System
Achieving High-Definition TEM Sample Preparation
Using a Single System
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SII NanoTechnology Inc. will release in December the
"SMI3000TB Series," the worldfs first commercially
available triple beam system that enables high-definition
TEM sample preparation with a single system.
With increasing semiconductor device design-rule miniaturization,
the demand for high-quality, high-resolution observation
using a transmission electron microscope (TEM) and
a scanning transmission electron microscope (STEM)
has increased, resulting in the need for compatible
high-quality TEM sample preparation technology that
ensures minimal sample damage. While the low acceleration
processing using an argon (Ar) ion beam is known as
a solution that allows preventing such damage, there
has been unresolved challenges in observing the sample
through an Ar ion beam alone: reliability in end point
detection and working efficiency in ultrathin TEM sample
preparation.
The SMI3000TB Series was developed based on a completely
new concept : the integration of a newly developed
Ar ion beam column with a double-beam system equipped
with a focused ion beam (FIB) and scanning electron
microscope (FE-SEM), resulting in the worldfs first
triple beam system that enables high-quality TEM sample
preparation with a single system. This new system removes
the damaged layer of a TEM sample prepared by focused
ion beam processing by using Ar ion beam milling in
the final finishing process. The system allows the
user to sequentially confirm sample shape using an
SEM monitoring function, thereby making end point detection
easy and drastically improving sample preparation accuracy
and working efficiency.
[Features]
1. Ideal for High-Quality TEM Sample Preparation
The new system enables positioning at specific locations
as well as end point detection during Ar ion milling.
By accurately emitting a low-acceleration Ar ion beam of 1 kV or less at
the processing location
of a sample arranged at the FIB and EB (electron beam)
coincidence point (beam intersecting point), the system achieves accurate,
low-damage sample
finishing. This allows the user to prepare a high-quality
TEM sample with a minimized damage layer.
2. Integrating the high-precision FIB processing
and Ar ion beam finishing
The SMI3000TB Series integrates FIB rough milling
and Ar milling, thereby improving the efficiency in working process. The
user can sequentially observe under the SEM a series of TEM sample preparation
process from high-precision FIB processing to low damage finishing using
a low-acceleration Ar ion beam, resulting in the improvement of reliability
in TEM sample preparation.
3. A Three-Model Lineup for Different Sample Sizes
A new product lineup includes three models, each
supporting a different sample size: 50 mm, 200 mm
and 300 mm. (SMI3050TB/SMI3200TB/SMI3300TB)
[Price]
SMI3050TB system 150 million yen
SMI3200TB system 180 million yen
SMI3300TB system 310 million yen
[Product release]
December 2005
[Triple Beam Structural Diagram]
[About SII NanoTechnology Inc.]
SII NanoTechnology Inc., a subsidiary of Seiko
Instruments Inc. (SII), is a leading company
in the development of advanced, leading edge measurement and analysis
instruments. Its head office is
located in Tokyo, Japan. It was the first Japanese
company to produce SPM and Focused Ion Beam (FIB) Systems. The company's
products line-up
also includes XRF Analyzers, XRF Coating Thickness
Gauges, Thermal Analysis Systems, ICP-OES, ICP-MS and Mask Repair Systems.
Many of these products
are utilized to support leading edge research
and development. Additional information about the company is available
on the Internet at http://www.siint.com/en/
| Contact
<Product Inquiry>
FIB Sales / Marketing Department
Tel: +81-3-6280-0065
<Press Contact:>
Promotion Group
Tel: ;81-3-6280-0061
Online Inquiry
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