SII Latest Topics on FIB

On October 6, SII Scientific Instruments Division FIB team (Toshiaki Fujii, Atsushi Yamauchi, and Takashi Kaito) gave a speech titled as “Fundamental Experience for Micro Mold Fabricated by FIB”, at “7th European FIB Users Group Meeting (EFUG 2003)” held in Palais des Congres, Arcachon, France.

Our latest model of FIB system “SMI3000 series”, which achieved the world’s highest resolution of 4nm@30kV, was introduced, followed by the speech on fabrication of nano scale 3-dimensional structures, enabled with our exclusive “3-dimantional deposition” technique. In the speech, example of complicated-form fabrication based on 3-D CAD data, were introduced. Lately, practical application of micro molds for nano imprinting is considered as one of the application fields of 3-D deposition. Changes derived from high-temperature processing of the 3-D deposition structure, conducted as a fundamental experiment of such application, were reported in the speech

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On November 3, SII Scientific Instruments Division FIB team (Hidekazu Suzuki and Toshiaki Fujii) gave a speech on TEM sample preparation at Focused Ion Beam User Group of “International Symposium for Testing and Failure Analysis (ISTFA)” held in Santa Clara Convention Center, Santa Clara, CA, USA

Titled as “An automated TEM sample preparation for Focused Ion Beam System, SMI-series”, function of Automated TEM, called ATEM, was introduced. ATEM, one of many applications of FIB, is a system that executes the processing on each fixed point, from die to die, using the pattern recognition function, and is useful for TEM sample preparation form the wafer. The speech especially focused on the result of evaluation on accuracy of cutting points and thickness of lamellas.

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